Low-temperature thermosetting structural adhesive is a one-component, fast-curing modified epoxy adhesive. It is designed specifically for CSP (FBGA) or BGA and is a reworkable underfill.
This glue can form a consistent and defect-free underfill layer, effectively reducing the impact caused by the thermal expansion coefficient mismatch between the chip and the substrate or external forces, thereby improving product reliability.
Low-temperature thermosetting glue usually refers to epoxy resin glue that is heated and cured under lower temperature conditions (such as 60 degrees, 70 degrees, 80 degrees), and is suitable for certain precision electronic components or LED components that are not resistant to high temperatures.
Key Features
- Fast-curing
- Reworkable underfill
- Improves product reliability
Segmentation by Type
- Epoxy Glue
- Polyurethane Glue
- Acrylic Glue
Segmentation by Application
- Consumer Electronics Industry
- Aerospace Industry
- Machinery Industry
- Others
Market by Region
- Americas
- APAC
- Europe
- Middle East & Africa
Company Coverage
- Henkel
- 3M
- Sika
- Huntsman Corporation
- LORD Corporation
- H.B. Fuller
- Permabond
- ITW Performance Polymers
- Master Bond
- Panacol-Elosol
- Pidilite Industries
- Dymax Corporation
- Chemence
- Techsil Limited
- Budnick Converting
- Protavic America
- Bostik
- Copps Industries, Inc.
- Dexerials
Key Questions Addressed in this Report
- What is the 10-year outlook for the global Low Temperature Thermosetting Structural Adhesive market?
- What factors are driving Low Temperature Thermosetting Structural Adhesive market growth, globally and by region?
- Which technologies are poised for the fastest growth by market and region?
- How do Low Temperature Thermosetting Structural Adhesive market opportunities vary by end market size?
- How does Low Temperature Thermosetting Structural Adhesive break out by Type, by Application?
Frequently Asked Questions
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Low Temperature Thermosetting Structural Adhesive report offers great insights of the market and consumer data and their interpretation through various figures and graphs. Report has embedded global market and regional market deep analysis through various research methodologies. The report also offers great competitor analysis of the industries and highlights the key aspect of their business like success stories, market development and growth rate.
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Low Temperature Thermosetting Structural Adhesive report is categorised based on following features:
- Global Market Players
- Geopolitical regions
- Consumer Insights
- Technological advancement
- Historic and Future Analysis of the Market
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Low Temperature Thermosetting Structural Adhesive report is designed on the six basic aspects of analysing the market, which covers the SWOT and SWAR analysis like strength, weakness, opportunity, threat, aspirations and results. This methodology helps investors to reach on to the desired and correct decision to put their capital into the market.